sexta-feira, 19 de maio de 2017

More details leak on the upcoming Kirin and Snapdragon flagship chipsets

It seems there’s some new information on the upcoming flagship chipsets of both Huawei and Qualcomm today, after a specs sheet containing some of the key specifications of the SD 845 and Kirin 970 SoC appeared online. According to it, both of these two chipsets will be built on the 10nm architecture but… with a twist:

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